Wafer & Substrate Probe Stations & Accessories

For 4”, 6”, 8” and 12” wafer
Stable probe station can reduce expendables used and prevent wafer scraped
Failure Analysis, Reliability, Device characterization, Wafer Acceptance Test, Quality Assurance and general purpose probing
Five levels configurations to choose from Manual, Motorized, Joystick programmable,Software programmable and Semi-Automatic.
    Can upgrade when you need, and just upgrade in your LAB
High performance thermal chuck system. The fastest transition times in the industry
Coolant temperature never exceeds 20 ºC. Temperature ranges as high as 600 ºC
Board mount chuck for mount various boards with test sockets
Deep Sub-micron, Resolution Probe Positioner 800 TPI

Auriga Measurement System

Precision Load Pull (PLP) Measurement System

Precision Noise Parameters (PNP) Measurement System

NP5 Software Upgrade Package

Pulsed IV (PIV) Measurement System - the highest current and voltage system available

Component Test System (CTS) - Integrated Module and MMIC Test Solution

High Current Bias Tees

Characterization, Modeling and Design services

   Small signal 0-50GHz

   Large signal 0-110GHz

   Load pull, single and multi-tone signal drive

   Noise

Semiconductor Reliability Test System

Parallel Architecture
    Can run many tests, at different temperature, at the same time.
    System expansion achievable
Can be configured for a mix of: (including analysis software)
    Copper and Aluminum Interconnects - EM, SM test algorithm
    Copper Dielectrics and Barrier Layers - BTS test algorithm
    Gate Oxides and MIM Capacitors - CVTDDB, SILC test algorithm
    MOS Transistors - HCI, VT, BTS, NBTI test algorithm
Support package (available for ESD protection) and wafer-level testing.

Single / Multi Die Probe Card for Reliability & Parametric

Easy to use on any kind of probe stations
Wide operating tempearture range -65 °C to 300 °C
Low leakage & low capactance
Single-site or Multi-site probing
Easy to repair, single pin replacement
Crash resistance technology
High performance total probe solutions

Plasma Solutions for Failure Analysis

Decap & Delayering.

Tuner based Load and Source Pull Measurement system - Smart Tuner^®

A new state-of-art automatic tuner for the Wireless Industry.

Fast tuning speed, high matching range and high power capability.

Sealed and rugged design, ideal for testing environments.

Small footprint and ease installation, a real benefit on any crowded bench, a probe station and
    the ever changing equipment sharing problem. sharing problem.

Advanced, user-friendly software.

Wireless Communication System Test Equipment

Carrier to Noise Generator - Precision BER versus C/N Testing using AWGN
White Gaussian Noise Generator
Satellite to Ground Station RF Link Emulator
Frequency Synthesizer - HF to 30GHz, Low Noise, 1 Hz Resolution
Multi-channel Broad Band Solid State Attenuator
Frequency Converters
RF Interfaces.

Photoelastic Modulator Based Precision Measurement System

Photoelastic Modulator (PEM)
Low Level Birefringence Measurement System
    Visible light to Deep UV
    Quality control metrology
    Low-level birefringence measurements of Plate glass, Scientific optical components, Laser crystals, DVDs
    Qualification of semiconductor photolithography components including
Calcium fluoride windows for operation at 193nm and below
Fused silica optical components, Stepper reticles

Optical Microscopes & Video Systems

Optical and Video Systems and accessories
A-Zoom Microscope
Confocal Microscope

High-Speed Singal Generation and Test & Measurement Equipment

TDR Instrument
    Provides differential and common mode 9ps TDR and 7ps TDT incident pulses.
    Enables increased resolution for TDR analysis of high-speed interconnects and circuits
    Improve TDR risetime
Pulse Generator
    Rise times as low as 5ps for time domain
    Step pulse, impulse waveform output application
Coaxial Components
    Bias Tees and DC Blocks provide excellent frequency and time domain response.
    Attenuators - Provide frequency response up to 60GHz.
    Low Pass Filters - Provide standard and custom absorptive filters.
    Power Dividers and Pick-Off Tees - Provide broadband device to combine and split signals up to 40GHz.

Parylene Deposition System / Bench Top Spin Coater

Bench Top Spin Coater
    Programmable and Non-programmable
    8", 12", 15" bowls
Hot Plate
     Temperatures from 50 °C to 150 °C
Parylene Coating System

WLR Reliability Test Algorithm

ICS - Interactive characterization software
IC/V - IV & CV automation software

Broadband Interconnect Characterization Systems & Services

Fixtures, probes, probes stations, Network Analyzers, TDRs and analysis software.
Measurements for verification and modeling of components such as connectors, IC packages,
    circuit boards, test sockets andpassives.
Signal integrity curriculum including introductory and advanced design classes.

Discrete Device Wafer & Substrate Probe Stations & Accessories (TOBI / Kyowa Riken)

For 2", 4" and 6" wafers.
General purpose and Hole Effect measurement.
Scriber capability

Spin Coater (TOBI / Kyowa Riken)

For 4", 5", 8" wafers
Programmable.

Coating Thickness Measurement (TOBI / Kyowa Riken)

Precise thickness measurement by Spherical Drilling Method
From 60mm to 150mm substrate.

Resistivity Measurement (TOBI / Kyowa Riken)

Resistivity Meter
Four Point Probes
Four Point Stages, for 50mm to 300mm substrates.

Mask Aligner (TOBI / Union / Kyowa Riken / Kontech)

For 3", 4", 6" wafers
Single Side / Double Side Exposure
Manual, Semiautomatic and Fully Automatic operation
Proximity / Soft Contact / Hard Contact / N2 Blow-up Hard Contact mode.
Desk top or floor-stand models.

Mask Cleaner (TOBI / World Engineering)

Automatic operation
200mm / 500mm mask.

Failure Analysis & DC Parametric Measurement

Multi-trace Curve Tracer
DC Parametric Tester

Real Time Load Pull and Multi-port Measurement System

Dragon Real Time Load Pull System - Expand traditional tuner system up to real time active test set.
   Use VNA to measure RF parameters, real vector information with much higher accuracy.
   No more cumbersome tuner characterization, greatly saving measurement preparation.
   Ultra Low Loss Head provides high RF directional couple with loss only 0.05dB at 2GHz.
   Compatible with all branches of automatic and manual tuners.
Multi-port Measurement System - Expand a 2-port VNA to a multi-port network analyzer.
   Automatic create calibration procedure with minimum cal. standard.
   Basic module, Dual module and Hub module to combine up to 64-port system.

Automatic, Accelerated, Reliability Test System

DC-18GHz, 60W RF device lifetest, includes stress and measurement.
   Stress temperature range: 50 °C to > 250 °C, stability of +/- 2 °C.
   Advanced multi-dimensional dynamic lifttest algorithm.
   32 RF Devices with individual DC Bias control, independent RF power level, and independent thermal control.
   Embedded third-party parametric analyzer, custom characterization and benchmarking.
   Simple user interface, collect and export data in raw or graphic.
Idea for SiGe, GaAs, InP, GaN, SiC material RF device.

Manual and Automatic Test Fixtures and Calibration Standards

RF Test Fixtures
    Packaged Devices
    Chip
    Substrate ( Microstrip & Coplanner )
Calibration Kits
Automated RF Device Handler
TDR and RF Probes

Map WareHouse

Accurate map data available
   Maps are stored in one central place per site
Map data is now available to every system
   A clear interface is designed for seamless integration with other system
Maps are exchangeable over different equipment type
   Conversion functionality for various map formats is available
Improved insight in your test process, maps are available almost directly after test
Yield analysis can be performed on maps or batches giving a clear insight in your production process
Exchanging maps over different production facilities is easier than ever
   Making it possible to share within your company and with customers or subcontractors

In Situ Host

Real Time Fault Detection with Residual Gas Analysis (RGA)
Synchronize the RGA data to the process tool, include data partitioning and sophisticated logic.
Statistical Control:
   Automatically obtain summary information for each run and input this information into the summary reports.
   Apply control limits on this data.
User friendly user interface