RTI-- IC & WLCSP Test Sockets

  Robson Technologies, Inc（RTI）

RTI designs and builds test sockets for small devices such as BGA, LGA, QFN, QFP, WLCSP, CSP, bare die, and more. We have a large variety of test sockets to support your specified test applications including ATE, burn-in, characterization, device programming, failure analysis, production test, and more. 

Incorporating floating or non-floating socket bases and multiple test site design options are just a couple of ways RTI helps improve your yield. 

RTI custom capabilities allow us to build socket solutions targeted to your device and test applications. Click the link below to learn more about RTI's IC & WLCSP sockets .

   ◆WLCSP test socket 

     with quartz or sapphire lid for 100% die visibility. Capable of testing device pitch <0.3mm. 

   ◆BGA socket    

      with an open-top, screw-down lid for top-side access to the package 

   ◆Dual site sockets

     with pockets for multiple package sizes. Includes a removable insert for hand test or pick and place applications. 

       WLCSP test socket                          BGA socket                               Dual site sockets

Consult of exact more products information,kindly Contact  SE TECHNOLOGIES CORP.

   info@se-group.com

   +886-3-579-9029/+86-21-3214-0732

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